Question

Which of the following material deposition techniques involves plasma for the deposition of the material?

• A. Co-precipitation
• B. Thermal evaporation
• C. Sputtering
• D. Sol-gel

Hint:

In thin film deposition, sputtering uses plasma to eject atoms from a target and deposit them onto a substrate, making it a key technique in semiconductor and material science.

Answer 1

The Correct Option is C

Sputtering is a material deposition technique that uses plasma to deposit material onto a substrate. In this process, atoms from the target material are ejected due to bombardment by energetic ions, usually in a plasma state. These ejected atoms then condense onto a surface, forming a thin film. Sputtering is commonly used in the deposition of thin films for electronic devices and coatings.
The other techniques listed:
- Co-precipitation involves the simultaneous precipitation of two or more substances from a solution.
- Thermal evaporation involves heating a material until it evaporates and then condensing it onto a substrate, but it does not require plasma.
- Sol-gel is a chemical solution process that involves the transition of a solution into a gel and is also not plasma-based.
Thus, Sputtering is the correct technique that involves plasma.