The
top-down approach in nanotechnology involves starting with bulk materials and using mechanical, chemical, or lithographic techniques to shape them into nanostructures. While this method is widely used in semiconductor and microfabrication industries, it faces a major limitation:
achieving atomic or near-atomic precision is extremely difficult.
This is because subtractive techniques such as etching or milling tend to lack the fine control required at the atomic scale, and the process may introduce defects, surface irregularities, or contamination.
Why the other options are incorrect: - (B) Generating bulk quantities is not typically the limiting factor in top-down techniques — it's more relevant to bottom-up scalability.
- (C) While cost can be a concern, precision remains the core technological challenge.
- (D) Stability issues are common in bottom-up approaches due to particle aggregation and surface effects, not top-down processes.
Thus, in the top-down method, the primary difficulty lies in
achieving atomic precision necessary for advanced nanotechnology applications.