Question:

In the silver plating of copper, $K[AG(CN)_2]$ is used instead of $AgNO_3. $ The reason is :-

Updated On: Apr 18, 2024
  • a thin layer of Ag is formed on Cu
  • more voltage is required
  • $Ag^+ $ ions are completely removed from solution
  • less availability of $Ag^+ $ ions, as Cu cannot displace Ag from $[Ag(CN)_2]^-$ ion
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The Correct Option is D

Solution and Explanation

In the silver plating of copper, $K[Ag(CN)_2] \, is $ used instead of $AgNO_3. $ The reason is less availability of $Ag^+ $ ions, as Cu cannot displace Ag from $[Ag(CN)_2]^-$ ion.
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Concepts Used:

Coordination Compounds

A coordination compound holds a central metal atom or ion surrounded by various oppositely charged ions or neutral molecules. These molecules or ions are re-bonded to the metal atom or ion by a coordinate bond.

Coordination entity:

A coordination entity composes of a central metal atom or ion bonded to a fixed number of ions or molecules.

Ligands:

A molecule, ion, or group which is bonded to the metal atom or ion in a complex or coordination compound by a coordinate bond is commonly called a ligand. It may be either neutral, positively, or negatively charged.